Company Profile
LB Semicon provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits. Its portfolio also includes gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic, solder bumps for various flip chip packages, Cu pillar bumps, Au RDL, which is used to reposition the layout of the I/O pad, and thick Cu products
Chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services Back side coating, foil mount, and tape and reel. Founded in 2000, LB Semicon is based in Pyeongtaek-Si, South Korea.