Company Profile
WINPAC produces and sells semiconductor packaging and testing solutions in South Korea. Its packaging products comprise fine pitch ball grid array typed packages for flash/SRAM/fast SRAM, flash/SRAM MCP/DRAM, and ASIC/logic/analog IC packaging.
Its portfolio also includes land grid array type packages for PC, memory, DDR2, graphic memory, and mobile phone packaging, and POP and flip chip package products. The company's packaging products also include quad flat packages for analog, ASIC, DSP, PLD, sensor, and micro-controller packaging.
Its portfolio also includes quad flat no lead packages for analog, ASIC, wireless RF, MEMS, cell phone, and laptop packaging, humidity sensor packages for automotive, home appliance, industrial HVAC, smart home products, and washing machine packaging, and proximity/ambient light sensor packages for smart phone, automotive, and home appliance
Smart, lighting, and display devices packaging, as well as USB flash drives for portable storage applications solid state drives for PC, mobile phone, and digital camera storage applications.
It also provides design and simulation services, as well as semiconductor testing services, including SOC and memory testing. Founded in 2002, WINPAC is based in Yongin-si, South Korea.