Company Profile
Kinsus Interconnect Technology provides the manufacture and sale of electronic products in Taiwan and globally. Its business is organized into the IC Substrate and Optics segments.
The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates
Modules in handset and wearable devices, as well as plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets flip chip chip scale package substrate for application processors and connectivity applications. Additionally, it offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications.
Its portfolio also includes radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications, and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications.
Additionally, it is involved in the manufacture and sale of medical equipment. Its portfolio also includes research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products Provision of after-sales services, and sale of cosmetic products. It also is involved in the wholesale and retail-sale of electronic materials.
Its portfolio also includes provision of business operation and management consultation services, production, manufacture, and sale of contact lenses, and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.