Company Profile
Winstek Semiconductor provides the testing of integrated circuits and chip bumping and wafer packaging services in Taiwan. It operates in three segments: Test Business, Packaging Business, and Factory Development.
The company offers test services, such as wafer sort, final and post-test, engineering support, and test platforms services; and bump services including copper pillar bump, wafer level chip scale package, lead free bump, plating bump/ball drop/RDL, 6S protection, heterogeneous bump, and backside metallization services
Backend services comprising die processing, wafer thinning, singulation, and flip chip services verification analysis services, such as failure analysis and reliability testing services.
Founded in 2000 and headquartered in Hsinchu City, Taiwan, the company was formerly known as Stats ChipPac Taiwan Semiconductor Corp. before rebranding in June 2015. Winstek Semiconductor Co., Ltd. is a subsidiary of SIGWIN Corporation.