Company Profile
Xintec is a wafer level chip scale packaging company in Asia, the United States, and Europe. The company provides wafer level chip scale packaging, wafer-level back cover packaging, and testing services for semiconductors
Optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via XinTSV, various glass thickness and filters, and glass bonding to wafer with or without cavity.
Its portfolio also includes FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications, and specialty RW service with a glass lid for automotive applications. Additionally, it provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad.
Its portfolio also includes CSP, using via last TSV to connect pad on wafer surface toward backside, dry etching silicon to form large cavities to derive product performance needs, and as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Founded in 1987, Xintec is headquartered in Taoyuan City, Taiwan.