Company Profile
Unisem (M) Berhad provides semiconductor assembly and test services for electronic companies in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip scale packaging
A range of leadframe and substrate integrated circuit packages, as well as test services comprising wafer probe and final testing on test equipment covering test platforms, such as radio frequency, analog, digital, and mixed signal
Test related services comprising reliability testing, thermal and electrical characterization, dry pack, and tape and reel. Additionally, it offers turnkey services, including design, assembly, test, failure analysis, warehousing, and drop-ship services
Marketing, administrative, and support services. The company serves its products to the fabless companies and integrated device manufacturers. Incorporated in 1989, the company is headquartered in Ipoh, Malaysia.