Company Profile
China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and globally.
The company offers image sensor, biometric identification, and ambient light sensor chips. Its portfolio also includes medical electronic devices, and manufacturing services of TSV and 3DIC technology, as well as design, test, and logistics solutions including design chain management.
Its portfolio also includes design for manufacturing, design for cost, and full design and verification of WL, lead frame, laminate, etc.. Its portfolio also includes electrical, thermal, and mechanical characterization, and quick turn prototype services, as well as packaging and testing services assembly services, such as turnkey solutions for TSV, wire bond, and flip chip.
Its portfolio also includes high-volume manufacturing, wafer finishing and 2/3D assembly, wafer to wafer and die to wafer bonding, micro-joining, and integrated and SMT passives
FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. It also engages in R&D. Its portfolio also includes patent management, field application promotion, investment management, and technology development activities.
It exports its products. The company serves mobile handset manufacturers and semiconductor chip design houses. Founded in 2005, China Wafer Level CSP is headquartered in Suzhou, China.