Company Profile
Chipbond Technology develops, manufactures, and sells driver IC and non-driver IC packaging and testing services in Taiwan and globally. The company offers back and front side metallization processing services.
Its portfolio also includes bumping manufacturing services, including gold, solder, and copper bumping services, redistribution layer services, test services, and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes
Chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services compound semiconductors including SiGe, GaAs, GaN, SiC, and wafers.
Its portfolio also includes flexible tape-and-reel circuit substrate, and chip tray. Additionally, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductors.
Its portfolio also includes invests in, develops, manufactures, and sells electronic components, and manufactures and sales elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.