Company Profile
Tong Hsing Electronic Industries provides the development and production of thick film substrates and customized semiconductor micro-module packaging. It offers ceramic metalized substrate, such as direct plated copper, direct bonded copper, active metal brazing, and thick film printed circuit substrates; CMOS imaging products
Including wafer probing and testing, wafer reconstruction, and packaging, and image testing, as well as high frequency wireless communication modules and power semiconductors module packaging products customized module packaging and testing comprising hybrid integrated circuit modules and biomedical products. Its products are used in automotive, handset, aerospace and network, medical, and others. The company was incorporated in 1974 and is based in New Taipei City, Taiwan.