Company Profile
Union Semiconductor (Hefei) packags and tests services for integrated circuits to display driver chip design companies in China and globally. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services.
Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, and electronic tags categories. Founded in 2015, the company is headquartered in Hefei, China.