Company Profile
ChipMOS TECHNOLOGIES develops, manufactures, and sells integrated circuits, and related assembly and testing services globally. Its business is organized into five segments: Testing.
Its portfolio also includes Assembly, Display Panel Driver Semiconductor Assembly and Testing, Bumping, and Others. The company offers leadframe-based packages, such as the small outline package, thin small outline package, and quad flat package.
Its portfolio also includes substrate-based packages, including FBGA, VFBGA, stacked chip-scale package, TFBGA, LGA, COG, and COF, and testing solutions comprising professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot run arrangement, engineering support, device failure mode analysis, and automation system for simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC devices, as well as bumping services.
Its portfolio also includes intellectual property management and enabling technologies, and turnkey services, such as wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment to display driver IC, memory IC, and logic mixed-signal IC. The company serves fabless companies, integrated device manufacturers, and foundries. Incorporated in 1997, ChipMOS TECHNOLOGIES is headquartered in Hsinchu City, Taiwan.