Company Profile
BE Semiconductor Industries develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and globally.
Its business is organized into three segments: Die Attach, Packaging, and Plating. The company offers single chip, multi chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, TCB and embedded bridge die bonding, die lid attach, and fan out wafer level packaging systems
Conventional, ultra-thin and wafer level molding, trim and form, and singulation systems, as well as tin, copper, precious metal and solar plating systems, and related process chemicals Tooling, conversion kits, spare parts, and services. The company sells its products under the Fico, Meco, Datacon, and Esec brands.
The company serves multinational chip manufacturers, foundries, assembly subcontractors and electronics, and industrial companies. Incorporated in 1995, BE Semiconductor Industries is headquartered in Duiven, the Netherlands.